LT메탈
KOENZH

본딩와이어

머리카락보다 가는 도선 하나가 반도체 칩과 리드 프레임 사이의 전기적 연결을 책임집니다.

A wire thinner than a human hair carries the electrical connection between the semiconductor chip and the lead frame.

제품규격

4N Au

Main purity 4N Au
Model HP/HS-S2H EW
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.5 2.0 0.7
um 15 18 20 23 25 28 30 33 38 50 18
Wire tolerance data ± 1.0um ± 1.0um
Breaking Load (gr) Room Temp Min. 2.5 Min. 4.0 Min. 6.0 Min. 8.0 Min. 10 Min. 11 Min. 13 Min. 16 Min. 21 Min. 35 Min. 4.0
Elongation (%) Room Temp 1 ~ 8 2 ~ 9 2 ~ 9 2 ~ 9 3 ~ 10 3 ~ 10 3 ~ 10 4 ~ 11 5 ~ 12 6 ~ 15 2 ~ 7
Grain Size (um) FAB 10 ~ 15 10 ~ 15 10 ~ 15 15 ~ 25 15 ~ 25 15 ~ 25 15 ~ 30 15 ~ 30 15 ~ 30 20 ~ 40 10 ~ 15
HAZ 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 7 3 ~ 7 3 ~ 7 4 ~ 10 2 ~ 5
Wire 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 3.0 1.5 ~ 3.0 1.5 ~ 3.0 2.0 ~ 4.0 2.0 ~ 4.0 2.0 ~ 4.0 3.0 ~ 6.0 1.5 ~ 2.5
HAZ Length(um) / FAB size =2.0WD 80 ~ 100 90 ~ 110 100 ~ 120 110 ~ 130 120 ~ 140 125 ~ 145 130 ~ 150 140 ~ 160 160 ~ 200 180 ~ 230 90 ~ 110
Hardness FAB 35 ~ 55 33 ~ 53
HAZ 35 ~ 55 33 ~ 53
Wire 40 ~ 60 38 ~ 58
Fusing Current (±0.02A, Length = 10mm) 0.28 0.36 0.41 0.47 0.56 0.64 0.70 0.76 0.95 1.37 0.36
Resistivity(uΩ ㎝) 2.3 2.3
Recrystallization temp(℃) 500 ~ 600 500 ~ 600
Elastic Modulus(Gpa) 75 ~ 85 75 ~ 85
Melting Point (Deg. ℃) 1050 ~ 1080 1050 ~ 1080
Density (g/cm3) 19.32 19.32

2N Au

Main purity Au 99%
Model HS-U
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.2 1.3 1.4 1.5 2.0
um 15 18 20 23 25 30 33 35 38 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2.5 Min. 4.0 Min. 6.0 Min. 8 Min. 10 Min. 14 Min. 16 Min. 18 Min. 21 Min. 35
Elongation (%) Room Temp 1 ~ 8 2 ~ 9 2 ~ 9 2 ~ 9 3 ~ 10 3 ~ 10 4 ~ 11 4 ~ 12 5 ~ 12 6 ~ 15
Grain size(um) FAB 10 ~ 15 10 ~ 15 10 ~ 15 15 ~ 25 15 ~ 25 15 ~ 30 15 ~ 30 15 ~ 30 15 ~ 30 20 ~ 40
HAZ 2 ~ 4.5 2 ~ 4.5 2 ~ 4.5 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 9
Wire 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 3.0 1.5 ~ 3.0 2.0 ~ 4.0 2.0 ~ 4.0 2.0 ~ 4.0 2.0 ~ 4.0 3.0 ~ 6.0
HAZ Length(um) / FAB size =2.0WD 45 ~ 65 50 ~ 70 60 ~ 80 65 ~ 85 70 ~ 90 80 ~ 100 90 ~ 110 100 ~ 130 110 ~ 140 130 ~ 180
Hardness FAB 40 ~ 60
HAZ 40 ~ 60
Wire 50 ~ 70
Fusing Current (±0.02A, Length = 10mm) 0.28 0.35 0.40 0.46 0.55 0.68 0.74 0.84 0.93 1.35
Resistivity(uΩ ㎝) 2.9
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 80 ~ 90
Melting Point (Deg. ℃) 1050 ~ 1080
Density (g/cm3) 19.20

Au-Ag Alloy

Main purity Au-Ag Alloy
Model HS-G3
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2
um 15 18 20 23 25 28 30
Wire tolerance data ± 1.0um
Breaking Load (gr) Room Temp Min. 3.0 Min. 5.0 Min. 6.0 Min. 7.0 Min. 8.5 Min. 11 Min. 12
Elongation (%) Room Temp 4 ~ 9 7 ~ 13 8 ~ 13 8 ~ 14 8 ~ 14 6 ~ 15 8 ~ 14
Grain size(um) FAB 8 ~ 13 8 ~ 13 8 ~ 13 10 ~ 15 10 ~ 15 10 ~ 15 13 ~ 18
HAZ 1.5 ~ 3.5 1.5 ~ 3.5 1.5 ~ 3.5 2.0 ~ 3.5 2.0 ~ 3.5 2.0 ~ 3.5 2.0 ~ 4.0
Wire 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 1.5 ~ 2.5 2.0 ~ 3.0
HAZ Length(um) / FAB size =2.0WD 45 ~ 65 50 ~ 70 55 ~ 75 60 ~ 80 65 ~ 85 70~90 80 ~ 100
Hardness FAB 45 ~ 65
HAZ 45 ~ 65
Wire 55 ~ 75
Fusing Current (±0.02A, Length = 10mm) 0.23 0.29 0.32 0.38 0.41 0.46 0.53
Resistivity(uΩ ㎝) 10.3
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 85 ~ 95
Melting Point (Deg. ℃) 1060 ~ 1090
Density (g/cm3) 16.57

Ag 98%

Main purity Ag 98%
Model HS-ES8
Wire diameter MIL 0.65 0.7 0.8 0.9 1.0 1.2 2.0
um 16 18 20 23 25 30 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2 Min. 3 Min. 5 Min. 8 Min. 10 Min. 14 Min. 40
Elongation (%) Room Temp 3 ~ 8 2 ~ 9 2 ~ 9 2 ~ 9 2 ~ 15 2 ~ 15 2 ~ 17
Grain size(um) FAB 14 ~ 20 14 ~ 20 14 ~ 20 17 ~ 27 17 ~ 27 22 ~ 32 25 ~ 35
HAZ 4 ~ 8 4 ~ 8 4 ~ 8 5 ~ 9 5 ~ 9 6 ~ 10 6 ~ 12
Wire 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 7
HAZ Length(um) / FAB size =2.0WD 65 ~ 85 65 ~ 85 75 ~ 95 80 ~ 100 85 ~ 105 90 ~ 110 110 ~ 130
Hardness FAB 40 ~ 50
HAZ 40 ~ 50
Wire 50 ~ 60
Fusing Current (±0.02A, Length = 10mm) 0.33 0.41 0.46 0.54 0.60 0.70 1.36
Resistivity(uΩ ㎝) 2.8
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 60 ~ 70
Melting Point (Deg. ℃) 980 ~ 1010
Density (g/cm3) 10.54

Ag 95%

Main purity Ag 95%
Model HS-ES5
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 2.0
um 15 18 20 23 25 28 30 33 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2.5 Min. 4 Min. 6 Min. 8 Min. 10 Min. 12 Min. 14 Min. 17 Min. 40
Elongation (%) Room Temp 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 16 5 ~ 17
Grain size(um) FAB 11 ~ 16 11 ~ 16 11 ~ 16 15 ~ 25 15 ~ 25 15 ~ 25 20 ~ 30 20 ~ 30 23 ~ 33
HAZ 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 7 3 ~ 7 3 ~ 9
Wire 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 5 2 ~ 5 2 ~ 6
HAZ Length(um) / FAB size =2.0WD 45 ~ 65 50 ~70 60 ~ 80 65 ~ 85 70 ~ 90 70 ~ 90 75 ~ 95 80 ~ 100 95 ~ 115
Hardness FAB 45 ~ 55
HAZ 45 ~ 55
Wire 60 ~ 70
Fusing Current (±0.02A, Length = 10mm) 0.31 0.39 0.45 0.52 0.58 0.63 0.68 0.75 1.34
Resistivity(uΩ ㎝) 3.5
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 60 ~ 75
Melting Point (Deg. ℃) 980 ~ 1010
Density (g/cm3) 10.58

Ag 88%

Main purity Ag 88%
Model HS-FG
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.5 2.0
um 15 18 20 23 25 28 30 33 38 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2.5 Min. 4 Min. 6 Min. 8 Min. 10 Min. 12 Min. 14 Min. 17 Min. 25 Min. 40
Elongation (%) Room Temp 1 ~ 8 2 ~ 9 2 ~ 9 2 ~ 9 3 ~ 10 4 ~ 11 4 ~ 11 5 ~ 12 6 ~ 13 9 ~ 16
Grain size(um) FAB 10 ~ 15 10 ~ 15 10 ~ 15 10 ~ 20 10 ~ 20 10 ~ 20 15 ~ 25 15 ~ 25 15 ~ 25 18 ~ 28
HAZ 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 7 3 ~ 7 3 ~ 7 3 ~ 9
Wire 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 5 2 ~ 5 2 ~ 5 2 ~ 6
HAZ Length(um) / FAB size =2.0WD 45 ~ 65 50 ~70 55 ~ 75 60 ~ 80 65 ~ 85 65 ~ 85 70 ~ 90 75 ~ 95 80 ~ 100 90 ~ 110
Hardness FAB 45 ~ 55
HAZ 45 ~ 55
Wire 60 ~ 70
Fusing Current (±0.02A, Length = 10mm) 0.31 0.38 0.44 0.51 0.57 0.59 0.66 0.73 0.92 1.32
Resistivity(uΩ ㎝) 4.7
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 60 ~ 70
Melting Point (Deg. ℃) 990 ~ 1015
Density (g/cm3) 10.96

Ag 79%

Main purity Ag 79%
Model HS-LS
Wire diameter MIL 0.7 0.8 0.9 1.0 1.1 1.2 1.3
um 18 20 23 25 28 30 33
Wire tolerance data ± 1.0um
Breaking Load (gr) Room Temp Min. 4 Min. 6 Min. 8 Min. 10 Min. 12 Min. 14 Min. 17
Elongation (%) Room Temp 2 ~ 9 2 ~ 9 2 ~ 9 3 ~ 10 4 ~ 11 4 ~ 11 5 ~ 12
Grain size(um) FAB 10 ~ 15 10 ~ 15 10 ~ 20 10 ~ 20 10 ~ 20 15 ~ 25 15 ~ 25
HAZ 2 ~ 5 2 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 7 3 ~ 7
Wire 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 4 2 ~ 5 2 ~ 5
HAZ Length(um) / FAB size =2.0WD 35 ~ 55 40 ~ 60 45 ~ 65 50 ~ 70 50 ~ 70 55 ~ 75 55 ~ 75
Hardness FAB 50 ~ 60
HAZ 50 ~ 60
Wire 60 ~ 70
Fusing Current (±0.02A, Length = 10mm) 0.36 0.42 0.49 0.55 0.57 0.64 0.71
Resistivity(uΩ ㎝) 7.11
Recrystallization temp(℃) 500 ~ 600
Elastic Modulus(Gpa) 70 ~ 80
Melting Point (Deg. ℃) 1000 ~ 1030
Density (g/cm3) 11.49

Pd Coated Cu wire / AuPd Coated Cu wire (4N)

Main purity Pd Coated Cu wire / AuPd Coated Cu wire (4N)
Model HS-RF2 / HS-GP, GPF, GPF PLUS
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.5 1.8 2.0
um 15 18 20 23 25 27 30 33 38 45 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2.0 Min. 3.0 Min. 4.0 Min. 5.0 Min. 6.0 Min. 7.0 Min. 10.0 Min. 12.0 Min. 15.0 Min.18.0 Min. 20.0
Elongation (%) Room Temp 5 ~ 15 6 ~ 16 6 ~ 16 8 ~ 20 8 ~ 20 10 ~ 25 10 ~ 25 10 ~ 30 10 ~ 30 10 ~ 30 10 ~ 30
Grain size(um) FAB 11 ~ 16 11 ~ 16 11 ~ 16 15 ~ 25 15 ~ 25 15 ~ 30 15 ~ 30 15 ~ 30 15 ~ 30 20 ~35 22 ~ 37
HAZ 4 ~ 7 4 ~ 7 4 ~ 7 5 ~ 10 5 ~ 10 5 ~ 15 5 ~ 15 5 ~ 15 5 ~ 15 6 ~ 18 6 ~ 18
Wire 1 ~ 5 1 ~ 5 1 ~ 5 1 ~ 5 1 ~ 5 2 ~ 6 2 ~ 6 2 ~ 6 2 ~ 6 3 ~ 7 3 ~ 7
HAZ Length(um) / FAB size =2.0WD 50 ~ 70 60 ~ 80 70 ~ 90 75 ~ 95 80 ~ 100 90 ~ 110 100 ~ 120 110 ~ 130 140 ~ 160 160 ~ 190 170 ~ 220
Hardness FAB 60 ~ 80
HAZ 50 ~ 70
Wire 55 ~ 75
Fusing Current (±0.02A, Length = 10mm) 0.33 0.42 0.47 0.58 0.65 0.70 0.83 0.94 1.13 1.55 1.72
Resistivity(uΩ ㎝) 1.9
Recrystallization temp(℃) 450 ~ 550
Elastic Modulus(Gpa) 90 ~ 100
Melting Point (Deg. ℃) 1080 ~ 1100
Density (g/cm3) 8.98 / 8.99

AuPd Coated Cu wire (High yield strength 4N)

Main purity AuPd Cu Wire (High yield strength 4N)
Model GPF Ultra
Wire diameter MIL 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.5 1.8 2.0
um 15 18 20 23 25 27 30 33 38 45 50
Wire tolerance data ± 1.0um ± 2.0um
Breaking Load (gr) Room Temp Min. 2.0 Min. 3.0 Min. 4.0 Min. 5.0 Min. 6.0 Min. 7.0 Min. 10.0 Min. 12.0 Min. 15.0 Min.18.0 Min. 20.0
Elongation (%) Room Temp 5 ~ 15 6 ~ 16 6 ~ 16 8 ~ 20 8 ~ 20 10 ~ 25 10 ~ 25 10 ~ 30 10 ~ 30 10 ~ 30 10 ~ 30
Grain size(um) FAB 11 ~ 16 11 ~ 16 11 ~ 16 15 ~ 25 15 ~ 25 15 ~ 30 15 ~ 30 15 ~ 30 15 ~ 30 20 ~35 22 ~ 37
HAZ 3 ~ 6 3 ~ 6 3 ~ 6 4 ~ 9 4 ~ 9 4 ~ 14 4 ~ 14 4 ~ 14 4 ~ 14 5 ~ 17 5 ~ 17
Wire 1 ~ 4 1 ~ 4 1 ~ 4 1 ~ 4 1 ~ 4 1 ~ 5 1 ~ 5 1 ~ 5 1 ~ 5 2 ~ 6 2 ~ 6
HAZ Length(um) / FAB size =2.0WD 50 ~ 70 60 ~ 80 70 ~ 90 75 ~ 95 80 ~ 100 90 ~ 110 100 ~ 120 110 ~ 130 140 ~ 160 160 ~ 190 170 ~ 220
Hardness FAB 63 ~ 83
HAZ 53 ~ 73
Wire 58 ~ 78
Fusing Current (±0.02A, Length = 10mm) 0.33 0.42 0.47 0.58 0.65 0.70 0.83 0.94 1.13 1.55 1.72
Resistivity(uΩ ㎝) 1.9
Recrystallization temp(℃) 450 ~ 550
Elastic Modulus(Gpa) 90 ~ 100
Melting Point (Deg. ℃) 1080 ~ 1100
Density (g/cm3) 8.99
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