Bonding Wire
Thousands of wires in a single chip. Not one of them may fail.
The quality of a single wire decides the yield of the whole chip.
LT Metal engineers that wire with 5N purity(99.999%) and 30 years of drawing expertise.
A bonding wire is the fine conductor that connects a semiconductor chip to its lead frame — the path through which the chip exchanges signals with the outside circuit. As Korea’s largest precious metals specialist, LT Metal manufactures and supplies bonding wire across the applications and specifications in use in the Korean market today, built on refined Au of 5N (99.999%) purity and higher and more than 30 years of wire-drawing expertise.
· Uniform, stable FAB (free air ball) geometry and excellent loop formability
· Tight control of elongation (E/L) and breaking load (B/L)
· Clean production lines and a rigorous quality control system
· More than 30 years of precious metals know-how
· Fast technical support backed by advanced analytical equipment
Product lineup
GBW (Gold Bonding Wire)
Standard bonding wire based on 4N and 2N gold and Au-Ag alloy. Stable FAB shape and excellent loop performance make it suitable for everything from memory to high-reliability packages, with a line-up that runs from soft (HS-H) to high strength (HS-S2H), high workability (HS-EW) and low cost (HS-G3).
SBW (Silver Bonding Wire)
Wire based on 79-98% silver alloy that lowers cost against gold while maintaining high electrical conductivity. It suits applications that demand cost and performance at the same time, and we supply four compositions by use, from high conductivity (HS-ES8) to high reliability (HS-LS).
CBW (Copper Bonding Wire)
Wire made from 4N copper with a Pd or Au-Pd coating. It delivers high current capacity and bond strength, and by controlling the coating composition and distribution you can choose from minimal pad damage (G1-S) to high yield strength (GPF Ultra) and high-reliability alloy (GPR).
| Purity | Product Type | Feature | |
|---|---|---|---|
| GBW(Gold Bonding Wire) | 4N | HS-H | Soft |
| HP | Universal | ||
| HS-S2H | High Strength | ||
| HS-EW | High Workability(For Memory PKG) | ||
| 2N | HS-U | High Reliability | |
| Au 80% | HS-G3 | Low cost | |
| SBW(Silver Bonding Wire) | 88% | HS-FG | Original type |
| 95% | HS-ES5 | Lower cost than Ag88% | |
| 98% | HS-ES8 | High Conductivity | |
| 79% | HS-LS | High Reliability | |
| CBW(Copper Bonding Wire) | 4N | HS-CL | Soft 4N (Not coated) |
| HS-RF2 | Pd coated Cu | ||
| HS-GP | Au&Pd coated Cu | ||
| GPF Plus | Higher Pd distribution | ||
| G1-S | Soft / Pad damage | ||
| GPF Ultra | Loop (High yield strength) | ||
| 2N | GPR | High Reliability (Alloyed) |
Why LT Metal
Three engineering capabilities
Global customers choose LT Metal because our design capability in composition, structure and reliability lets us deliver the performance and quality they ask for. This is LT Metal's core strength.
We design the composition.
The purity of the wire and its trace additives determine FAB shape, loop stability and bond strength. LT Metal secures its own precious metal refined to 5N or higher, and designs compositions to match your package conditions and cost targets — from gold and silver alloys to coated copper.
We design the structure.
Through wire drawing and heat treatment we design grain size, HAZ length, hardness and elongation. We supply the full diameter range from 0.6MIL (15㎛) to 2.0MIL (50㎛) within a ±1.0㎛ tolerance, and can match specifications to your equipment and process conditions.
We design the reliability.
We control elongation (E/L) and breaking load (B/L) to tight limits, and run a verification system that reflects real bonding conditions — a clean production line, despooling tests and surface organic carbon (TOC) analysis. When a bonding defect occurs, our in-house analytical equipment lets us identify the cause and propose a direction for improvement quickly.
