Thin film materials
Material properties decide display performance.
At LT Metal, we push that precisionone step further every day.
Thin-film materials form functional metal layers from a few nanometers to a few micrometers thick, deposited by sputtering or evaporation. The purity, density, crystal structure, and compositional uniformity of the target directly determine the electrical and optical properties of the film. Across semiconductors, displays, solar cells, and medical devices, thin-film material quality determines both product performance and manufacturing stability. LT Metal brought ITO target production to Korea with its own powder synthesis technology. Building on years of metal alloy expertise, we deliver consistent quality and stable performance in both ceramic and metal targets.
Process selection guide
Sputtering vs. evaporation — the right material for each process
| Process | Best suited to | Materials supplied by LT Metal | Key applications |
|---|---|---|---|
| Sputtering | Large-area film uniformity, high adhesion | Ceramic targets, high-purity metal and precious-metal targets, hybrid targets | FPD, semiconductor interconnects, OLED reflective layers |
| Evaporation | High purity, low oxygen content | High-purity, low-oxygen Ag disks, pellets, and granules | OLED panels, research and development |
Sputtering targets
| Product family | Product | Purity | Composition | Applications | |
|---|---|---|---|---|---|
| Display | Ceramic
(Planar, Rotary) |
ITO | 4N or higher | 1/3/5/7/10% SnO2(other compositions on request) | Transparent electrodes, solar, and more |
| IGZO | 4N or higher | 1:1:1(other compositions on request) | TFT semiconductors | ||
| IZO | 4N or higher | 10%(other compositions on request) | Transparent electrodes, solar, and more | ||
| ITZO | 4N or higher | On request | TFT semiconductors | ||
| Mo oxide-based | 3N5 or higher | On request | Low reflectance | ||
| Metal
(Planar, Rotary) |
Ag | 4N5 or higher | Pure & Alloy | Anodes and more | |
| Cu | 4N5 or higher | Pure | Electrode interconnects | ||
| Mo | 3N5 or higher | Pure & Alloy | Electrode interconnects | ||
| Al | 4N or higher | Pure & Alloy | Electrode interconnects | ||
| Ti | 3N5 or higher | Pure & Alloy | Electrode interconnects | ||
| Cr | 4N or higher | Pure & Alloy | Photo mask | ||
| Hybrid
(Ceramic+Metal) |
WOX | 4N or higher | On request | Low reflectance | |
| Semiconductor | Metal
(Planar, Rotary) |
Ta | 4N5 or higher | Pure | Diffusion barrier layer |
| CuMn | 6N (99.9999%) or higher | On request | Semiconductor interconnects | ||
| Au | 4N5 or higher | Pure | Bumping | ||
| Cu | 4N5 or higher | Pure | EMI-Shield | ||
| SUS | 3N or higher | SUS304L, SUS316L | EMI-Shield | ||
| Ni | 3N5 or higher | Pure | Back-end processes | ||
| Metal | Pt | 4N or higher | Pure | Wafer deposition |
Evaporation
| Product family | Product | Purity | Composition | Applications | |
|---|---|---|---|---|---|
| Evaporation materials | Ag | Disk | 4N or higher | Pure Ag | Large OLED panels |
| Granule | 4N or higher | Pure Ag | Small and mid-size OLED panels | ||
| Pellet | 4N or higher | Pure Ag | Small OLED panels | ||
| Pt | Pellet | 3N5, 4N or higher | Pure Pt | Electrode interconnects |
Product lineup
· Packaging: +82-32-820-9694
· Thin-film: +82-32-820-9694
Sputtering targets for semiconductors
Ta and CuMn (diffusion barrier), Cu and SUS (EMI shield), and Au and Ni (bumping) targets.
Sputtering targets for displays
ITO and IGZO (FPD, touch panel, solar cell), ITZO and IGZO (OLED, oxide TFT), metal (interconnect), Ag alloy (OLED reflective layer), and Mo/W-based (low-reflectance) targets.
Evaporation materials
Ag disks, Ag granules, Ag pellets, and Pt pellets.
Why LT Metal
Three engineering capabilities
Global customers choose LT Metal because our engineering capability in composition, structure, and reliability delivers the performance and quality they specify. That is our core strength.
We engineer composition.
The alloy composition and impurity level of a target directly determine the electrical and optical properties of the film. LT Metal analyzes your deposition conditions — temperature, pressure, and power density — and engineers a target with the composition to match.
We engineer structure.
Our proprietary technology synthesizes the powders for ITO and other functional targets in-house, so particle size distribution, oxygen content, and sintered density are engineered from the start. The result is a target structure that suppresses particle generation and arcing.
We engineer reliability.
We do more than supply material. We engineer a reliability support system around your deposition process: process condition reviews, prototype evaluation, and root-cause analysis when problems arise.
